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Base material: Ceramics, Aluminum, Rogers, high Tg, F4B, F4BK, F4BT, TP, PF, FR4, FR1, FR2, CEM-1, CEM-3, etc. Board thickness: 0. 30 To 3. 20mm (12 To 26mil) Copper thickness: 0. 50 To 5 ounce Solder mask: LPI solder mask, conventional solder mask, peelable solder mask, UV solder mask Minimum line width: 0. 1mm (4mil) Minimum line space: 0. 1mm (4mil) Minimum hole diameter: 0. 25mm (10mil) PTH hole diameter tolerance: +/-0. 076mm (+/-3mil) NPTH hole diameter tolerance: +/-0. 03mm (+/-1. 2mil) Maximum board size: 460 x 620mm (18 x 24) Board finishing type: Hot air leveling, soft gold, hard gold, immersion gold, gold fingers